Taping

For applications in electronic component production we offer tape and reel packing (blister tape) of your stamping parts according to DIN IEC 286. Packing is performed in-house.

We offer our customers taping of standard and non-standard components; taping of active and passive components as well as taping of radial and axial components.
Our services at a glance:

Taping of ICs on precision carrier tapes
Taping of Quad Flat Packs / QFPs
Bake and dry of moisture-sensitive components
Taping of active & passive components
Taping of non-standard components
Vacuum packing of the taped ICs in MBBs
Taping of radial components
Taping of axial components

Gurten